TOP-388 桌面微型选择性波峰焊-电子研发中心*设备
TOP-388 desktop micro selective soldering electronic research center - necessary equipment
电子技术研发中心*设备 波峰焊 TOP-388（通孔返修工作站） (2015-09-26 12:54:01)[编辑][删除]转载▼
Electronic technology R & D center essential equipment micro wave soldering TOP-388 (thru-hole rework station) (2015-09-26 12:54:01) [editor] [] delete print reprint
标签： dip返修 通焊焊接 桌面焊接 小型波峰焊 插件焊接 分类： SMT资料
Tags: dip repair by welding welding soldering welding small desktop plug-in: SMT data classification
传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起，
Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together,
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主，
The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components,
以通孔元件为辅，比如接插件，大容量电容，变压器等。为了避免对表面贴装元件的二次焊接（波峰焊），
The through-hole components such as connectors, auxiliary, large capacitance, transformer etc.. In order to avoid the two welding of surface mount components (wave),
可以采用针对局部的通孔器件选择性的进行小波峰焊接。这种选择性的焊接可以是自动选位置的选择性波峰焊，
Can be used for selective partial via device for small wave soldering. This selective welding can be selective soldering automatic position,
也可以是根据焊接的对象大小，设计成不同规格的喷锡口。将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。这种方法焊接的效，不伤及其他器件，与波峰焊相比节能。
Also can be according to the welding object size, designed to different specifications of the mouth spray tin. The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start. The efficiency of this method of welding, and other devices, such as compared with wave soldering.
从电路板上拆除多引脚的通孔元件和大热容量的通孔元件比较麻烦，比如变压器、接插件。对这种对象传统的方
Removed from the circuit board through-hole components via multi pin component and the large heat capacity is quite troublesome, such as transformer, connector. The object of the traditional party
法是采用手工的吸锡抢或金属吸锡线，但是效率低、容易损伤板子和器件。
Method is a manual suction grab or metal tin tin absorption line, but low efficiency, easy to damage the board and device.
采用喷流焊的方法拆除这些通孔元件可以避免这些问题。将电路板放置在焊台上，针对要解焊的通孔器件，
Using the method of jet welding dismantling these through-hole components to avoid these problems. The circuit board is placed in the welding stage, according to the device through hole welding solution,
选择合适的喷锡口，启动波峰，一次性同时融化所有的通孔引脚，从而安全方便地将器件从电路板上取下来
Select the appropriate tin spray mouth, start the crest, the through hole pin at the same time all to melt, safe and convenient device will take off from the circuit board
通孔返修站（返修插件） 通孔元件喷流焊和返修工作站 TOP-388 升级版 技术营销： 陈工
Through hole rework station (repair plug) through hole components of jet welding and repair work station TOP-388 upgraded version of technology marketing: Chen Gong
喷流DIP返修设备又称喷流锡炉或喷流式锡炉,它采用喷流锡液直接作用於焊点，主要适用於多引脚通孔器件的拆、焊。如：DIP（双列直插）IC ，PBGA，接插件，连接器插座等
Jet DIP rework equipment also known as tin or tin jet jet, it adopts direct jet of molten tin in solder joint, mainly used for welding demolition, multi pin hole device. Such as: DIP (DIL) IC, PBGA, connector, connector socket etc.
数字温度设定，即时温度显示
Digital temperature setting, real-time temperature display
高性能PID 温度控制器,精度±1℃
High performance PID temperature controller, the accuracy of plus or minus 1 DEG C
锡波可以TIMER设定喷流时间,PC板及零件不易受损
Tin wave can TIMER jet set time, PC plate and the parts are not easy to be damaged
可以根据需要，设定喷流锡液的高度及流量
May need to set height and flow tin liquid jet
配备安全回路,锡温未达设定温度,马达无法运转
Equipped with safety circuit, tin Weida temperature setting temperature, the motor can operate
附中心定位灯,定位简单,操作容易
Of center positioning lamp, simple positioning, easy operation
作业桌面为开放式,并附防静电桌垫,作业空间大,适合大型基板
Operation desktop for open, with anti-static mat, large working space, suitable for large substrate
备多种选用喷咀可供选择,并接受特殊喷咀定制
Used to produce a variety of nozzles are available, and accept the special custom nozzle
加热器加热迅速,较适用多层基板
Heating rapidly, the application of multilayer substrate
又称喷流锡炉或喷流式锡炉,它采用喷流锡液直接作用於焊点，主要适用於多引脚通孔器件的拆、焊。如：DIP（双列直插）IC ，PBGA，接插件，连接器插座等
Also known as tin or tin jet jet, it adopts direct jet of molten tin in solder joint, mainly used for welding demolition, multi pin hole device. Such as: DIP (DIL) IC, PBGA, connector, connector socket etc.
数字温度设定，即时温度显示
Digital temperature setting, real-time temperature display
高性能PID 温度控制器,精度±1℃
High performance PID temperature controller, the accuracy of plus or minus 1 DEG C
锡波可以TIMER设定喷流时间,PC板及零件不易受损
Tin wave can TIMER jet set time, PC plate and the parts are not easy to be damaged
可以根据需要，设定喷流锡液的高度及流量
May need to set height and flow tin liquid jet
配备安全回路,锡温未达设定温度,马达无法运转
Equipped with safety circuit, tin Weida temperature setting temperature, the motor can operate
附中心镭射灯,定位简单,操作容易
Attached heart laser lamp, simple positioning, easy operation
作业桌面为开放式,并附防静电桌垫,作业空间大,适合大型基板
Operation desktop for open, with anti-static mat, large working space, suitable for large substrate
备多种选用喷咀可供选择,并接受特殊喷咀定制
Used to produce a variety of nozzles are available, and accept the special custom nozzle
加热器加热迅速,较适用多层基板
Heating rapidly, the application of multilayer substrate
主要功能配置:
The main function of configuration:
一．数字温度设定，即时温度显示；
A digital temperature setting, real-time temperature display;
二．高性能PID 温度控制器,精度±1℃ ；
Two. High performance PID temperature controller, the accuracy of plus or minus 1 DEG c;
三．锡波可以TIMER设定喷流时间,PC板及零件不易受损 ；
Three. Tin wave can TIMER set jet time, PC plate and the parts are not easy to be damaged;
四．可以根据需要，设定喷流锡液的高度及流量 ；
Four. According to the needs, set the height and the flow of molten tin jet;
配备安全回路,锡温未达设定温度,马达无法运转；五.附中心定位灯,定位简单,操作容易 ；
Equipped with safety circuit, tin Weida temperature setting temperature, the motor can operate; five. Attached center positioning lamp, simple positioning, easy operation;
六．作业桌面为开放式,并附防静电桌垫,作业空间大,适合大型基板 ；
Six. Work for desktop open, with anti-static mat, large working space, suitable for large substrate;
七． 备多种选用喷咀可供选择,并接受特殊喷咀定制 ；
Seven. Prepare a variety of choice of nozzle can be used to choose, and to accept the special nozzle custom;
八。加热器加热迅速,较适用多层基板 ；
Eight. Heater heats up quickly, the most suitable multilayer substrate;
九．锡槽&加热器材质为进口不锈钢。(抗腐蚀)
Nine. Tin Bath & heater material for imported stainless steel. (corrosion resistance)
主要技术参数:
Main technical parameters:
1.电源：220V 50HZ ；
1 power supply: 220V 50HZ;
2.焊锡重量：约15kg；
2 solder weight: about 15kg;
3.容锡高度：50MM；
3 Rong tin height: 50MM;
3.焊锡温度：0～450度，随意设置，智能温控保护；
3 solder temperature: 0 ~ 450 degrees, optional settings, intelligent temperature control protection;
4.机械尺寸：600(L)*400(W)*280(H)，立式；
Mechanical dimensions: 4 (L) *400 (W) *280 () (H), vertical;
5.多喷口选配。
5 multi nozzle matching.
6.PCB尺寸：450*450MM
6.PCB size: 450*450MM
7.加热器功率： 1200W
7 heater power: 1200W
8.安全装置：马达**载保护
8 safety devices: motor overload protection
9.时间设定：1~60S
9 time setting: 1~60S
10.机器重量：40KG
10 machine weight: 40KG
