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I-PULSE M20 YAMAHA 高精度贴片机
I-PULSE M10 YAMAHA 高精度贴片机
M20较大对应基板尺寸L1240*510 LED灯板 贴装效率高!!
贴装速度6个头贴装一个小时30000CPH
各项规格 | M10 | M20 |
基板尺寸(1驱动) | 较小L50XW30MM-较大L740XW510MM | 较小L50XW30MM-较大L1210XW510MM |
基板尺寸(2驱动)※1 | 较小L50XW30MM-较大L540(460※2)XW510MM | 较小L50XW30MM-较大L1640XW510MM |
基板尺寸(3驱动)※1 | ——— | 较小L50XW30MM-较大L1540XW510MM |
基板厚度 | 0.4-4.8mm | 0.4-4.8mm |
基板搬送速度 | 较大900mm/秒 | 较大900mm/秒 |
贴装速度(4轴贴装头+1θ)较适条件 | 0.15秒/CHIP(24000CPH) | 0.15秒/CHIP(24000CPH) |
(4轴贴装头+4θ)较适条件 | 0.15秒/CHIP(24000CPH)※1 | 0.15秒/CHIP(24000CPH)※1 |
(6轴贴装头+2θ)较适条件 | 0.12秒/CHIP(30000CPH)※1 | 0.12秒/CHIP(30000CPH)※1 |
(4轴贴装头+1θ)IPC9850 | 19000CPH | 19000CPH |
(4轴贴装头+4θ)IPC9850 | 19000CPH※1 | 19000CPH※1 |
(6轴贴装头+2θ)IPC9850 | 23000CPH※1 | 23000CPH※1 |
贴装精度A(u+3ó) | CHIP±0.040mm | CHIP±0.040mm |
贴装精度B(u+3ó) | IC±0.025mm | IC±0.025mm |
贴装角度 | ±180° | ±180° |
Z轴控制 | AC伺服马达 | AC伺服马达 |
θ轴控制 | AC伺服马达 | AC伺服马达 |
可贴装元件高度 | 较大30mm※3(先贴较大元件高度为25mm) | 较大30mm※3(先贴较大元件高度为25mm) |
可贴装元件类型 | 01005-120X90mm BGA、CSP、插座元件等其它异型元件 | 01005-120X90mm BGA、CSP、插座元件等其它异型元件 |
元件搬送形态 | 8-56mm带式、管式、矩阵盘式 | 8-56mm带式、管式、矩阵盘式 |
元件带回判定 | 负压检查及图像检查 | 负压检查及图像检查 |
多语言画面显示 | 日语、中国语、韩国语、英语 | 日语、中国语、韩国语、英语 |
基板定位 | 边固定式基板固定装置、前部基准、传送带自动调幅 | 边固定式基板固定装置、前部基准、传送带自动调幅 |
元件品种数较大 | 72品种(换算为8mm料带)36联X2 | 144品种(换算为8mm料带)36联X4 |
基板搬送高度 | 900±20mm | 900±20mm |
设备尺寸、重量 | L1250XD1750XH1420mm、约1300KG | L1750XD1750XH1420mm、约1500KG |
电源 | 三相200、208、220、240、380、400、416、 | 三相200、208、220、240、380、400、416、 |
440V±10%(标准装备有变压器)50/60Hz | 440V±10%(标准装备有变压器)50/60Hz | |
较大消耗电力、设备电源容量 | 0.77KW、8.3KVA | 1.1KW、8.3KVA |
空气压力、空气使用量 | 0.45Mpa、50(4轴)75(6轴)L/min.A.N.R |
0.45Mpa、50(4轴)75(6轴)
|
M20
Handling max. 1,480mm ultra long board as standard
Revolutionary and unique new features included as standard
New Multi-Conveyor System providing the highest large board handling capability
3D hybrid placement functions
Wide ranging component handling capability and high feeder capacity
Ultimate flexibility and fast & easy setup
Board size(with buffer unused) Min. L50 x W30mm to Max. L1,480 x W510mm*1
Board size(with input and output buffers used) Min. L50 x W30mm to Max. L540 x W510mm
Board thickness 0.4 - 4.8mm
Board flow direction Left to right (Std)
Board transfer speed Max 900mm/sec
Placement speed (4 heads + 1 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH)
Placement speed (4 heads + 4 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH)
Placement speed (6 heads + 2 theta) Opt. Cond. 0.12sec/CHIP (30,000CPH)*2
Placement speed (4 heads + 1 theta) IPC9850 19,000CPH
Placement speed (4 heads + 4 theta) IPC9850 19,000CPH
Placement speed (6 heads + 2 theta) IPC9850 23,000CPH*2
Placement accuracy A (μ+3σ) CHIP +/-0.040mm
Placement accuracy B (μ+3σ) IC +/-0.025mm
Placement angle +/-180 degrees
Z axis control AC servo motor
Theta axis control AC servo motor
Component height Max 30mm*3 (Pre-placed components: max 25mm)
Applicable components 01005 ? 120x90mm, BGA, CSP, connector, etc.
Component package 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
Drawback check Vacuum check and vision check
Screen language English, Chinese, Korean, Japanese
Board positioning Board grip unit, front reference, auto conveyor width adjustment
Component types Max 144 types (8mm tape), 36 lanes x 4
Transfer height 900 +/- 20mm
Machine dimensions, weight L1750xD1750xH1420mm, Approx. 1450kg
Power 3-phase 200/208/220/240/380/400/416/440V +/-10%
(Transformer included), 50/60Hz
Max consumption, capacity 1.1kW, 5.9kVA
Air pressure, consumption 0.45Mpa, 50(4 heads) or 75(6 heads) L/min A.N.R.
M10
Handling large board as standard
Revolutionary and unique new features included as standard
New Multi-Conveyor System providing the highest large board handling capability
3D hybrid placement functions
Wide ranging component handling capability and high feeder capacity
Ultimate flexibility and fast & easy setup
Board size(with buffer unused) Min. L50 x W30mm to Max. L980 x W510mm *1
Board size(with input or output buffer used) Min. L50 x W30mm to Max. L420 x W510mm
Board size(with input and output buffers used) Min. L50 x W30mm to Max. L330 x W510mm
Board thickness 0.4 - 4.8mm
Board flow direction Left to right (Std)
Board transfer speed Max 900mm/sec
Placement speed (4 heads + 1 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH)
Placement speed (4 heads + 4 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH)
Placement speed (6 heads + 2 theta) Opt. Cond. 0.12sec/CHIP (30,000CPH)*2
Placement speed (4 heads + 1 theta) IPC9850 19,000CPH
Placement speed (4 heads + 4 theta) IPC9850 19,000CPH
Placement speed (6 heads + 2 theta) IPC9850 23,000CPH*2
Placement accuracy A (μ+3σ) CHIP +/-0.040mm
Placement accuracy B (μ+3σ) IC +/-0.025mm
Placement angle +/-180 degrees
Z axis control AC servo motor
Theta axis control AC servo motor
Component height Max 30mm*3 (Pre-placed components: max 25mm)
Applicable components 01005 ? 120x90mm, BGA, CSP, connector, etc.
Component package 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
Drawback check Vacuum check and vision check
Screen language English, Chinese, Korean, Japanese
Board positioning Board grip unit, front reference, auto conveyor width adjustment
Component types Max 72 types (8mm tape), 36 lanes x 2
Transfer height 900 +/- 20mm
Machine dimensions, weight L1250xD1750xH1420mm, Approx. 1,150kg
Power 3-phase 200/208/220/240/380/400/416/440V +/-10%
(Transformer included), 50/60Hz
Max consumption, capacity 1.1kW, 5.5kVA
Air pressure, consumption 0.45Mpa, 50(4 heads) or 75(6 heads) L/min A.N.R.